English
The processing of chips involves a series of steps such as wafer cleaning, thermal oxidation, thin film deposition, photolithography, etching, ion implantation, annealing, diffusion, chemical mechanical polishing, inspection, and so on, eventually creating a specific integrated circuit structure on the wafer. The realization of these semiconductor process steps requires high standards for semiconductor processing equipment and their components. Among these, in equipment like etching and thermal oxidation, silicon components are widely used in semiconductor process equipment because of their excellent thermal stability and low thermal expansion coefficient.
Silicon components are machined parts that need to go through processes such as crystal growth, slicing, grinding, drilling, polishing, cleaning, and inspection. The general manufacturing process is as follows:
Crystal Growth→Slicing→CNC Grinding→Drilling→Polishing→Inspection→Warehousing
The quality of silicon components is highly correlated with the production yield of the equipment. The main parameters that customers focus on are as follows:
Parameter Name | Parameter Description |
Purity | Semiconductor-grade monocrystalline silicon needs to meet the requirements of 9N-11N. |
Diameter | Depends on customer requirements |
Thickness | Depends on customer requirements |
Resistivity | Resistivity is mainly divided into three categories: low, medium, and high; specifics are chosen according to customer requirements |
Oxygen Content | ≤30ppma |
Carbon Content | ≤1ppma |
Coaxiality | Coaxiality is the degree to which the axes of two cylindrical surfaces are coaxial; the smaller the value, the better |
Flatness | Flatness represents the deviation between the product surface and an absolute horizontal plane; the smaller the value, the better |
Advanced semiconductor processes have extremely high requirements for various parameters of silicon components. This is because, in thousands of chip manufacturing processes, any defects in the purity, impurity content, flaws, machining precision, and consistency of silicon components are significantly magnified. Therefore, silicon component manufacturing companies need to have an extremely high level of machining capability and the ability to supply high-quality raw materials. In addition, silicon carbide semiconductor companies need to have a high level of production management capability to strictly control the steps of production, cleaning, surface treatment, inspection, and packaging, ensuring product yield.
