Resistivity Control: DSTC single crystal silicon ingot offers precise resistivity control, ensuring consistent electrical properties. This feature is crucial for applications requiring high-performance and reliable semiconductor materials.
Manufacturability: The single crystal ingot from DSTC is designed with superior manufacturability in mind. This ensures ease of processing and integration into various semiconductor manufacturing workflows, enhancing overall production efficiency.
Pioneering Large Size Pulling Technique: Devoted to developing advanced large-size pulling techniques, DSTC is the first domestic manufacturer to supply single crystal silicon ingots with diameters greater than φ620mm. This innovation allows for the production of larger wafers, meeting the growing demands of the semiconductor industry.
1. The single crystal ingot from DSTC has a maximum diameter of 620mm;
2. Almost complete lattice structure, similar to the preparation method of semiconductor wafers;
3. High purity, few defects and low impurities;
4. The same crystal orientation in the plane, and less difference in physical properties;
5. Excellent resistivity calculation and application method to control single-crystal ringot resistivity accurately;
DSTC Single Crystal Ingots are mainly used to process and manufacture silicon parts for etching equipment. Their quality and performance directly affect the efficiency of etching processing and have a significant impact on the etching yield, making the single crystal ingots an important silicon material in the integrated circuit industry chain.
The biggest single-crystalline silicon ingot of OD 620mm in mass production succeeefully in the world.