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This type of silicon parts from DSTC is made by single or multi-crystalline silicon ingot materials. The outside diameter of the silicon ring is up to 650mm. The silicon ring is used in the dry etching machine as the focus ring, outer electrode, confinement ring.
Establishment of Plasma Etching Condition: DSTC silicon ring is designed to establish optimal plasma etching conditions. This ensures precise and efficient etching processes, making silicon rings essential silicon components in advanced semiconductor manufacturing.
Use as Electrodes for RF Units: The silicon ring from DSTC can be used as electrodes for RF units. This versatility enhances its functionality in various high-frequency applications, providing reliable performance and stability.
Control Sidewall Damage and Improve Etching Aspect Ratios: DSTC silicon ring effectively controls sidewall damage of reactive substances. It improves etching aspect ratios and optimizes etching surfaces, resulting in higher precision and better-quality outcomes in etching processes.
Improve Uniformity and Yield of Silicon Wafer Edges: The silicon ring from DSTC significantly improves the uniformity and yield of silicon wafer edges. This enhancement leads to higher overall efficiency and productivity in semiconductor fabrication.
| Outer Diameter | Within 650mm |
| Crystal Orientation | Customized |
| Conductive Type/Doping: | Custom |
| Resistivity | Low Resistance (E.G.<0.015,<0.02...). ; |
| Moderate Resistance (E.G.1-4); | |
| High Resistance (E.G. 60-90); | |
| Customer Customization | |
| Thickness | Customized |
| Other Specifications | Customized |
1. DSTC Silicon Rings are used as electrodes in CCP/ICP etching equipment to focus and drive plasma for wafers;
2. Silicon rings from DSTC can optimize etching performance/uniformity at the edge of wafers.
The Silicon Ring from DSTC is used in the dry etching machine as the outside electrode or the lower electrode.
